Boiling Electronics to keep them COOL...
The Next Step in Liquid Cooling
We're changing the game in liquid cooling technology. This system is not about some great cold plate, it's not about an exotic metal matrix, it's not about a gee whiz TIM, rather it's about fundamentally changing the cooling process. We're exploiting the heat of vaporization which means that instead of pumping hot fluid around we are letting the fluid change state from liquid to gas. It takes lots of energy to change state and we capture that energy and transport it from where it's not wanted to where it can be safely released.
Increased Power Density in a Smaller Footprint
- The system self optimizes by simply boiling more, this is a perfect solution for variable load devices like hybrid power modules
- 2-4x better heat transfer
- No Altitude derating
- No Thermal derating
- The system is isothermal across a cold plate, across the system
- No set up, system is shipped precharged and ready
- Low flow rates, 1/6 that of EG water systems
- Smaller pumps, less costly, no maintenance, 50,000hr L10 life
- No end user maintenence, no filters to change, no DI cartridges
So what does this mean to you?
- Size/space reduction of enclosures (by 30-50 %)
- Reduction of power wiring and switchgear
- Simplified l-c power filter configuration (lower cost)
- Reduced HVAC system heat load
- Simplified heat exchanger system
- Reduced shipping and site transportation costs
- Commissioning time reduced
- Increased system reliability & MTBF
